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82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide Application Note (AP-468)

Revision 2.1 April 2005 ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel product(s) described herein may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800- 548-4725 or by visiting Intel's Web site at http://www.intel.com. Copyright © 2005 Intel Corporation * Other product and corporate names may be trademarks of other companies and are used only for explanation and to the owners’ benefit, without intent to infringe. ii Application Note (AP-468) 82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide Revision History Revision 0.6 0.7 1.0 1.1 1.2 1.3 2.0 2.1 Revision Date Jun 2004 Jul 2004 Aug 2004 Oct 2004 Nov 2004 Dec 2004 Feb 2005 Apr 2005 Description • Initial release • Distinguished 82562G Family from other products in line. • Added references to MDI/MDI-X feature. • Initial release White Cover Confidential (WCC). • Corrected LED configuration modes. • Replaced MagJack* references with magnetics modules. • Updated reference schematics. • Added Appendix A “Measuring LAN Reference Frequency Using a Fre- quency Counter. • Removed confidential status. • Added reference schematics. • Added 82541PI(ER) board design and layout information to match reference schematics. • Removed 82562G(GT) Shrink Small Outline Package (SSOP) information. This information now resides in the 82562ET/GT/G LAN on Motherboard Design Guide. • Added internal/external pull-up/pull-down resistor values for hardware con- figuration signals TESTEN, ISOL_EXEC, ISOL_TI, ISOL_TCK, and ADV10/ LAN_DISABLE#. • Added a note on sheet 2 of reference schematics stating CLK_RUN# is not applicable to the 82541ER. Application Note (AP-468) iii 82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide Note: This page is intentionally left blank. iv Application Note (AP-468) 82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide Contents 1.0 2.0 3.0 Introduction .............................................................................................. 1 1.1 Scope .......................................................................................................................1 1.2 Terms.......................................................................................................................1 1.3 Reference Documents .............................................................................................2 1.4 Product Codes .........................................................................................................2 1.5 82541PI(ER) Read the full 82541PI(ER) and 82562GZ(GX) Dual Footprint LOM Design Guide Application Note (AP-468).

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