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Ruggedized MicroTCA* and AMC* for Military Applications

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Ruggedized MicroTCA* and AMC* for Military Applications

Introduction
The PCI Industrial Computer Manufacturers Group (PICMG) ratified the specification for Micro Telecommunication Computing Architecture* (MicroTCA) in July 2006. Incorporating the Advanced Mezzanine Card* (AMC) module standard, MicroTCA has been adopted by a growing ecosystem of suppliers to the telecommunications industry, as well as vendors serving industrial, medical, military, aerospace, and homeland security market segments for embedded computing and communications.

The MicroTCA standard represents the evolution of PICMG’s AdvancedTCA* standard for telecommunications. It is designed to meet system-level requirements for reduced size, weight and power, in addition to higher levels of compute performance/watt/square inch in communications and computing devices. MicroTCA provides vendors who serve the Department of Defense (DoD) with a framework for the development of validated network-centric platforms for small, highly cost-effective network devices the next generation of network-centric battlefield systems.

The PICMG Subcommittee on Ruggedized MicroTCA is the working group of ecosystem vendors responsible for developing detailed specifications for extended temperature operation, shock/vibration and other characteristics applicable to harsh environments, such as industrial and military applications. Several vendors have proceeded with proof of concept designs in advance of these specification efforts. This paper provides an overview of the status of ruggedized MicroTCA from the perspective of BAE Systems, Emerson Network Power, Hybricon and Schroff Ltd. based on informal surveys conducted by Intel.

Read the full Ruggedized MicroTCA* and AMC* for Military Applications White Paper.