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2nd Gen Intel® Core™/Intel® Xeon® E3-1200 Processors: Spec, Vol. 1

Spec, Vol. 1: Power, thermal, and electrical specs for 2nd gen Intel® Core™ desktop and Intel® Xeon® E3-1200 processor families. (v.2.1, Feb. 2011)

Intel® Centrino® Advanced-N 6205: Hardware Spec

Hardware Specification: Contains Intel® Centrino® Advanced-N 6205 electrical, thermal, and mechanical specifications. (v.002.5, Aug. 2012)

Intel® Core™ i7 Processor-Based Low-Power Platform: Addendum

Design Guide Addendum: Provides additional design recommendations for the Intel® Core™ i7 processor-based low-power platform. (v.002.4, Apr. 2011)

Intel® ME and Intel® AMT 8.0: Product Requirements Document

Product Requirements Document: Requirements, features, and functions for the Intel® ME and Intel® AMT 8.0, for development teams. (v.001, Nov. 2011)

Penryn Processor Thermal Test Vehicle: User Guide

User Guide: Penryn Thermal Test Vehicle aids in system design and thermal solution testing, with functionality and sensor details. (July 2007)

Intel® Data Plane Development Kit: Overview

Overview: Information on the Intel® Data Plane Development Kit, designed for superior packet processing performance. (v.1.6, July 2012)

Intel® C600 Series and Intel® X79 Express Chipset: Spec

External Design Specification: Describes Intel® C600 series and Intel® X79 Express Chipset registers, descriptions, and specs. (v.2.1, May 2012)

Processing Multiple Buffers in Parallel for Performance

White Paper: How processing multiple independent data buffers in parallel dramatically increases performance without SIMD on Intel® processors.

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인텔® DK300 시리즈 개발 키트

사물 인터넷 시장 요구사항의 새로운 추세에 부응하는 지능형 게이트웨이를 빠르게 개발, 프로토타입 및 배포합니다.

인텔® DK200 시리즈 개발 키트

사물 인터넷 시장 요구사항의 새로운 추세에 부응하는 지능형 게이트웨이를 빠르게 개발, 프로토타입 및 배포합니다.