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Intelligent Pluggable System Specification Platform Spec

Specification: Hardware, software, and the building blocks that make up the base platforms, primary, and additive components. (v.1, Mar. 2014)

Digital Signage Open Pluggable Specification - China Plus (OPS-C+)

Electrical, mechanical, and thermal specs for interactive whiteboard & digital signage Open Pluggable Specification - China Plus (OPS-C+).

Retail Solution: Digital Signage Network Remote Management

Elevate the shopping experience, generate additional revenue, and eliminate the cost of traditional signs using a digital signage network.

던킨 도넛츠를 위한 뛰어난 디지털 사이니지 제공

사례 연구: 던킨 도넛츠를 위한 인텔® 기술 기반의 디지털 사이니지는 메뉴판을 효율화하고, 특화된 내용을 제공하며, 고객 만족도를 높여줍니다.

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2nd Gen Intel® Celeron® Processor 847E Development Kit

Find an overview, features, and resources of the 2nd gen Intel® Celeron® processor 847E with Intel® QM77 Chipset development kit. (v.1, Sept. 2013)

3rd Gen Intel® Core™ i3-3217UE Processor Development Kit

Find an overview, features, and resources of the 3rd gen Intel® Core™ i3-3217UE processor with Intel® QM77 Chipset development kit. (v.1, Sept. 2013)

4th Gen Intel® Core™ i3-4100E Processor with Intel® QM87 Chipset

Find 4th gen Intel® Core™ i3-4100E processor with mobile Intel® QM87 Chipset development kit info for digital signage, POS, and home. (v.1, Dec. 2013)

Intel® Core™ i5-3610ME Processor Development Kit

Intel® Core™ i5-3610ME processor and mobile Intel® QM77 Express Chipset-based development kit overview, product brief, and guides. (v.1, June 2013)

3rd Gen Intel® Core™ i7-3517UE Processor Development Kit

Find an overview, features, and resources of the 3rd gen Intel® Core™ i7-3517UE processor with Intel® QM77 Chipset development kit. (v.1, Sept. 2013)

Norco BIS-6630* Intel® Atom™ Processor D2550 Development Kit

Development resources for the Intel® Atom™ processor D2250-based Norco BIS-6630* compact fanless embedded PC. (v.1, June 2013)