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Intel® Mobile Phone Platforms

Our system platforms combine cost-optimized ICs, reference designs, and feature-rich software stacks with professional customer support throughout the value chain. Its small size together with the flexible, modular concept of our system platform offers you the possibility to leverage one design into various fields of applications, such as mobile phones, mobile computing or telematics.

Product list and key features

Product Protocol Description Features

Intel® XMM™ 1010 platform

GSM/GPRS Based on Intel® X-GOLD™ 101 single-chip, the Intel XMM 1010 platform pioneered the ultra-low cost (ULC) market with a revolutionary 2G-baseband and platform solution.

•  Industry first phone on a chip: baseband, RF engine, power management, and memory

•  Enable low BOM for black and white handsets

•  Best in class GSM/GPRS modem

Intel® XMM™ 1100 platform

GSM/GPRS Based on Intel X-GOLD 101 single-chip, the Intel XMM 1100 platform is a ULC feature evolution, 65-nm phone on a chip integrating additional functionality such as FM Radio, MP3, and sufficient memory to support a colour display phone without external SRAM.

•  GSM, dual SIM

•  Lowest BOM by integrated FM Radio, SRAM, serial Flash, and low-cost PCB

•  Lowest power consumption—less than 1mA idle current, best-in-class talk current

Intel® XMM™ 1180 platform

GSM/GPRS Based on Intel® X-GOLD™ 118 single-chip, the Intel XMM 1180 platform is a GPRS system-on-a-chip in 65nm, the high integration and possibility to use low-cost PCB makes it the ideal solution for lowest cost messaging and multimedia phones.

View the Intel® XMM™ 1160 platform and Intel® XMM™ 1180 platform brief >

•  GPRS with great multimedia performance and user experience

•  Dedicated 1.3Mp camera support, integrated FM-Radio, MP3, and USB

•  Lowest power consumption—best-in-class talk current

Intel® XMM™ 2130 platform and Intel XMM™ 2150 platform
EDGE Based on Intel® X-GOLD™ 213 single-chip and Intel® X-GOLD™ 215 single-chip, the Intel XMM™ 2150 platform and Intel® XMM™ 2150 platform is an EDGE system-on-a-chip in 65nm with multimedia performance typical for higher segments. The high integration level and possibility to use low cost PCB makes it possible to develop lowest cost EDGE browsing and multimedia phones.

View the Intel® XMM™ 2130 platform and
Intel® XMM™ 2150 platform brief >

•  EDGE downlink at cost of GPRS, enabling low-cost mobile browsing

•  Powerful CPU for great multimedia performance

•  Common software architecture for scalability from 2G to 3G

•  Integrated FM-Radio

•  Lowest power consumption—best-in-class talk current

Intel® XMM™ 2230 platform and Intel® XMM™ 2250 platform
EDGE Based on the X-GOLD™ 223/225 EDGE+Bluetooth* system-on-a-chip, the Intel XMM™ 2230/2250 platforms deliver an unrivalled level of performance and integration for the feature phone segment.

View the Intel® XMM™ 2230 platform and 
Intel® XMM™ 2250 platform brief >

• Quad band EDGE downlink

• Integrated Bluetooth* 4.0+BLE

• Integrated FM Radio with RDS and transmit capability

• 5 Mpix imaging support with HW ISP

• Fast CPU with advanced cache architecture

Intel® XMM™ 6140 platform
HSDPA Based on Intel X-GOLD 213 single-chip and Intel® SMARTI™ UE RF transceiver, the Intel® XMM™ 6140 platform is a cost-optimized 3G feature phone solution enabling affordable mobile broadband devices for Emerging Markets.

•  Cost-effective platform for rich multimedia and browsing experience

•  Common CPU architecture enables scalability from 2G to 3G

•  Worldwide proven HSDPA Rel.6 modem stack

Intel® XMM™ 6260 platform
HSPA+ Based on Intel® X-GOLD™ 626 digital- and analog- baseband with integrated Power Management Unit and the Intel® SMARTi™ UE2 transceiver for 2G and 3G, the Intel® XMM™ 6260 platform is the smallest available HSPA+ modem supporting a global connectivity within one stock keeping unit.

View the Intel® XMM™ 6260 platform brief >

•  HSDPA and HSUPA capabilities of 21Mbps and 5.7Mbps with EDGE multislot class 33

•  Penta-band 3G, quad-band EDGE with Receive Diversity type 3i

•  Supports worldwide connectivity in one design

•  Extremely small PCB footprint and power consumption

•  Hardware and software interfaces to applications processors or to a PC as a wireless modem

Intel® XMM™ 6360 platform
DC-HSPA Based on Intel® X-GOLD™ 636 digital- and analog-baseband with integrated Power Management Unit and the Intel® SMARTi™ UE3 transceiver for 2G and 3G, the Intel®XMM™ 6360 platform is the smallest available DC-HSPA modem supporting a global connectivity within one stock keeping unit.

View the Intel® XMM™ 6360 platform brief >

HSDPA and HSUPA capabilities of 42Mbps and 11.5Mbps with EDGE multislot class 33

•  Multi-band Penta-band 3G, quad-band EDGE  for worldwide connectivity

•  Supports worldwide connectivity in one design

•  Excellent power consumption and extremely small PCB footprint

•  Hardware and software interfaces to applications processors or to a PC as a wireless modem

Intel® XMM™ 7160 platform
Multimode LTE & DC-HSPA Based on Intel® X-GOLD™ 716 digital and analog baseband with integrated Power Management Unit and Intel® SMARTi™ transceiver for 2G, 3G, 4G, and LTE, the Intel® XMM™ 7160 platform is the most compact solution for LTE and DC-HSPA smartphones for worldwide deployment.

View the Intel® XMM™ 7160 platform brief >

•  LTE capabilities of 150Mbps and 50Mbps (Cat 4)

•  HSDPA and HSUPA capabilities of 42Mbps and 11.5Mbps with EDGE multislot class 33

•  Multi-band LTE, penta-band 3G, quad-band EDGE  for worldwide connectivity

•  Excellent power consumption and extremely small PCB footprint

•  Hardware and software interfaces to applications processors or to a PC as a wireless modem