Intel® Cyclone® 10 GX FPGA
Intel® Cyclone® 10 GX FPGA is the first low-cost devices built on a high-performance 20 nm process, offering a performance advantage for cost-sensitive applications.
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Intel® Cyclone® 10 GX FPGA
Architecture
Intel® Cyclone® 10 GX FPGA has adopted a column I/O structure with 12.5 Gbps transceivers on the left-hand side of the die. The GPIO in vertical columns are in banks of 48 I/Os, each with a high-efficiency memory controller and I/O phase-locked loop (PLL). Each GPIO bank also supports LVDS pairs, with each pair having differential input and output buffers allowing users to configure the LVDS direction for each pair at 1.4 Gbps.
DSP Blocks
Intel® Cyclone® 10 GX devices are enhances with hardened floating-point operators in the device digital signal processing (DSP) block. The Intel® Cyclone® 10 GX FPGA variable-precision DSP block introduces a new floating-point mode that delivers breakthrough floating-point performance.
With the three modes available for Intel® Cyclone® 10 GX device DSP blocks: Standard-precision fixed-point (18 bit fixed-point mulitpliers), high-precision fixed-point (27 bit fixed-point mulitpliers), and single-precision floating-point, designers can implement a variety of algorithms that require fixed point all the way to double-precision IEEE 754 compliant floating-point operations. Hardened floating-point processing offers designers the ability to implement algorithms in floating point with the similar performance and power efficiency as fixed point. This can be achieved without any power, area, or density compromises and with no loss of fixed-point features or functionality.
External Memory Interfaces
Intel® Cyclone® 10 GX devices provide an efficient architecture that allows up to 72 bit wide of DDR3 memory interfaces at up to 1,866 Mbps. This is to support a high level of system bandwidth within the small modular I/O bank structure. The I/Os are designed to provide high-performance support for existing and emerging external memory standards.
Compared to previous generation of Cyclone® FPGAs, the new architecture, and solution provide the following advantages:
- Pre-closed timing in the controller and from the controller to the PHY
- Easier pin placement
For maximum performance and flexibility, the architecture offers hard memory controller and hard PHY for key interfaces.
- The solution offers completely hardened external memory interfaces for several protocols
- The devices feature columns of I/Os that are mixed within the core logic fabric instead of I/O banks on the device periphery
- A single hard Nios® II processor block calibrates all the memory interfaces in an I/O column
- The I/O columns are composed of groups of I/O modules called I/O banks
- Each I/O bank contains a dedicated integer PLL (IO_PLL), hard memory controller, and delay-locked loop
- The PHY clock tree is shorter compared to previous generation Cyclone® devices and only spans one I/O bank
Single Event Upset (SEU) Mitigation
Single-event upsets (SEUs) are rare, unintended changes in the state of internal memory elements caused by cosmic radiation effects. The change in state results in a soft error and there is no permanent damage to the device.
Intel® Cyclone® 10 GX FPGAs ensure high reliability and with specific SEU mitigation capabilities.
- Advanced SEU detection (ASD) and correction
- Error detection through cyclic redundancy check (CRC) scrubbing with automatic correction
- Sensitivity processing
- Hierarchy tagging
- Fault injection
- Use to characterize, test, and improve your designs
Transceivers (12.5 Gbps)
Intel® Cyclone® 10 GX devices offer up to 12 low-latency transceiver channels with integrated advanced high-speed analog signal conditioning and clock data recovery techniques for chip-to-chip applications.
Intel® Cyclone® 10 GX device offers a maximum frequency of 12.5 Gbps per transceiver I/O for chip-to-chip communications. The Intel® Cyclone® 10 GX device also enables higher rate protocols, such as GigE Vision, USB 3.1, CoaXPress, Camera Link, DisplayPort 1.3, and HDMI in a low-cost solution. Intel® Cyclone® 10 GX devices also support backplane driving at data rates up to 6.6 Gbps.
A column array of transceiver I/O banks on the left-side periphery of the device, each bank contains six transceiver channels. Intel® Cyclone® 10 GX devices also include a PCI Express* Gen2 Hard IP block for applications, such as connecting to an external Intel® processor.
Nios® II Processor
Nios® II processor, the world's most versatile, royalty-free processor according to Gartner Research is the most widely used soft processor in the FPGA industry. The Nios® II processor delivers unprecedented flexibility for your cost-sensitive, real-time, safety-critical (DO-254), and ASIC-optimized applications processing needs.
The Nios® II processor family consists of two configurable 32 bit Harvard architecture cores:
- Fast (/f core): Six-stage pipeline optimized for highest performance, optional memory management unit (MMU), or memory protection unit (MPU)
- Economy (/e core): Optimized for smallest size, and available at no cost (no license required)
Need to boost performance? No problem. Hardware acceleration is as easy as using an FPGA's programmable logic to offload and accelerate tasks that are typically implemented in an application software. Find out more on the Nios® II Processor web page.
For more information on free software development tools, visit the Nios® II Processor Design Tools web page.
For Nios® II processor training, visit the Intel® FPGA Technical Training web page.
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