Mobile 10th Gen Intel® Core™ U- and Y-Series Processors Brief

Big-Time Entertainment in Remarkably Thin and Light Designs

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New 10th Gen Intel® Core™ U-Series and Y-Series Processors

With 10th Gen Intel® Core™ mobile processors, it’s now possible to enjoy incredibly immersive entertainment on a remarkably thin and light laptop.

10th Gen Intel® Core™ processor-powered systems featuring the latest Intel® Iris® Plus graphics1 take a huge leap forward in gaming, streaming and creativity, pushing a smooth, detailed and vivid experience on highly portable devices. But the entertainment experience isn’t the only leap forward for 10th Gen Intel® Core™ processors: They also pack battery life optimized for marathon work and play sessions, built-in intelligence features designed to help you get more done, easier than ever before, and the latest in wireless and wired standards for incredibly fast connectivity. 10th Gen InteI® Core™ mobile processors bring big-time entertainment—and much more—to ultra-portable devices.

Built for the AI Software of the Future

Stunning Entertainment
For such thin and light devices, systems powered by 10th Gen Intel® Core™ processors with the latest groundbreaking improvements to Intel® Iris® Plus graphics pack hugely immersive entertainment. These systems let you play popular games like [Battlefield V*] at 1080p with smooth frame rates, and stream 4K HDR video in all its vivid and detailed richness. They can even handle 4K video editing and high-res photo-processing like a pro—fast, while retaining high visual quality—both previously a stretch for thin and light devices.

Intelligent Performance
10th Gen Intel® Core™ mobile processors optimize built-in intelligent performance features that make it possible for your PC to quickly learn and adapt to what you do. Built for the AI software of the future, a laptop powered by a 10th Gen Intel® Core™ processor gives you the PC experiences you’ve always wanted, like automatic photo masking and quick application of video filters. You can get more done on an intelligent PC that’s ready for the software of today and tomorrow.

Fast, Flexible, and Easy Connectivity

Best Connectivity
Systems powered by 10th Gen InteI® Core™ mobile processors feature best in class wireless and wired standards for fast, flexible, and easy connectivity. Intel® Wi-Fi 6 (Gig+) PCs and routers enable ultra-fast, ultra-responsive connections for browsing, streaming, gaming, or working, even in environments with many connected devices. Thunderbolt™ 3 technology2—the fastest USB-C available—allows you to connect multiple peripherals, docks, displays, and even power using a single cable at lightning-fast speeds.

U-Series and Y-Series Processor Performance Features

Features3 4

ICE Lake U

ICE Lake Y

CPU/Memory/Graphics Overclocking

No

No

Intel® Extreme Tuning Utility (Intel® XTU)

No

No

Intel® Hyper-Threading Technology (Intel® HT Technology)

Yes

Yes

Intel® Smart Cache technology with Last Level Cache (LLC) sharing between Processor and GFx cores

Yes

Yes

Intel® Smart Sound Technology (Intel® SST)

Yes

Yes

Intel® Gaussian & Neural Accelerator (Intel® GNA) 1.0

Yes

Yes

Intel® Turbo Boost Technology 2.0

Yes

Yes

Intel® Turbo Boost Max Technology 3.0

No

No

Intel® Speed Shift Technology

Yes

Yes

Per core p-states

Yes

Yes

Last Level Cache (LLC)

Up to 8M

Up to 8M
4NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.
5Level of support may vary by SKU.
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U-Series and Y-Series Processor Power Specifications

 

TDP5 NOMINAL

cTDP6 DOWN

cTDP6 UP

Ice Lake Y

9 W

N/A7

12 W

Ice Lake U Intel® Iris® Plus (48EU, 64EU)

15 W

12 W

25 W8

Ice Lake U UHD (32EU)

15 W

13 W5

25 W8

88W cTDP down available on ICL Y Core i3.

9Not available on ICL U Core i3 SKUs.

6ICL U UHD SKUs available with 12W cTDP down.

7TDP workload does not reflect various I/O connectivity cases such as iTBT. Refer to the Platform Design Guide (Doc #572907), Thermal Power Consideration section for adjustments to the base TDP required to preserve base frequency associated to the sustained long-term thermal capability.
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U-Series and Y-Series Processor Power & Thermal Management Features

Features3

ICE Lake U

Ice Lake Y

Package and Platform (PL1/PsysPL1) level thermal control (enhanced efficiency utilizing Hardware Duty Cycling)

Yes

Yes

Converged Power and Thermal Throttling for DDR memory RAPL

Yes

Yes
Dynamic Platform & Thermal Framework (Intel® Dynamic Tuning Technology) including9: Dynamic Power Performance Management (DPPM)10, Dynamic Battery Power Technology, Processor Low Power Mode, PCH I/O Throttling, and Power Management

Yes

Yes

HD Audio D3 State

Yes

Yes

Intel® Display Power Saving Technology (Intel® DPST)

Yes

Yes
Intel® Power Optimizer 2 (CPPM, Hardware Controlled P-states, semi-active workload optimization utilizing HW duty Cycling)

Yes

Yes

On die Power Control Unit

Yes

Yes

Panel Self Refresh 2.0

Yes

Yes

PECI (Platform Environmental Control Interface) 3.0

Yes

Yes

Power Aware Interrupt Routing (PAIR)

Yes

Yes

Low Power Idle with Processor C-states

Up to C10

Up to C10

Microsoft Windows* Connected Standby/Modern Standby Support

Yes

Yes

4NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.

11Deep S3 is a term used to describe several methods Intel plans to promote to minimize S3 power consumption.

10Included features are NOT available on all platforms with Intel® Dynamic Tuning Technology.
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ICL Graphics Features

 

Features3

ICE LAKE U

ICE LAKE Y

3D

Intel® Integrated Graphics

Yes

Yes

Execution Units

Up to 64 EUs

Up to 64 EUs

3D Architecture Improvements

Yes

Yes

Open GL 4.5, DirectX 12

Yes

Yes

COMPUTE

OpenCL™ 2.2 applications

Yes

Yes

PLATFORM

HARDWARE

10 nm process

Yes

Yes

PCIe* Configurations for dGFX

1x4

No

PCIe* Gen3.0 Support

Yes

Yes
Switchable graphics / Hybrid Graphics (muxless solution)11

Yes

NO

4NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.

12Switchable Graphics will be referred to as Hybrid Graphics in Windows* 8.1, Windows* 10. Not supported Linux.
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ICL Media

Features3

ICE LAKE U & Y

FF Decode

2x 4k60 8b 4:2:0 AVC/VP8

4K60 10b 4:2:2/4:4:4 HEVC/VP9

8K30 10b 4:2:0 HEVC/VP9

FF Encode

(VDEnc)

2x 4K60 8b 4:2:0 AVC

4K60 10b 4:4:4 HEVC/VP9

8K30 10b 4:2:0 HEVC/VP9

Programmable Encode (PAK/VME)

4K60 8b 4:2:0 AVC

4K60 10b 4:2:0 HEVC

Post Processing

VEBox 10b DN, HDR Tone Mapping, BT2020 support (constant luminance)

Content Protection

Support Playready SL3000, HDCP 2.2 (wired and wireless)
4NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.
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ICL Display

Features3

ICE LAKE U & Y

Displays

3 Display Pipes

eDP

Max Resolution (1 pipe/1 port)

eDP 1.4b HBR3, VDSC 1.1, 2-ports, PSR 2 (only on 1-Port), MSO 2x2

4K120/5K6012 (10b)

HDMI

Max Resolution (1 pipe/1 port)

HDMI 2.0b 10b formats, HDCP2.2

4K60 (10b)

DP

Max Resolution (1 pipe/1 port)

DP 1.4 HBR313, VDSC 1.1, HDCP 2.2

4K120/5K60 (10b14)

TBT/USB-C*

Integrated Mux (up to 4 ports on ICL-U, up to 3 on ICL-Y)

(USB, TBT, DPoC)

HDR Support

 HDR10 HW support. (BT.2020 24bpc precision pipeline, Improved HDR tone mapping), FP1615

FB Formats

P010, P012, P016

420/422/444 6b/8b/10b/12b/16b

Visual Quality

5K 7x7 Adaptive Linear Scalers, 4K LACE DPST, 3DLUT HW on 1 pipe

4NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.

13Resolution are supported when VDSC enabled, PSR2 is not supported concurrent with VDSC.

14Using ModPHY / Type –C. ComboPHY will only support DP 1.4 w HBR2.

15For streaming over 4k60 (10bit) content on more than one stream simultaneously, additional thermals need to be considered.

16May need additional thermal requirements.
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U-Series Processor Feature Benefits

Features

Benefits

CPU
  • 10nm CPU / 14nm PCH

GFX
  • Gen 11 Intel Graphics Engine, up to 64EU

Memory
  • DDR4 up to 3200, LPDDR4/x 3733

Imaging
  • Enhanced IPU4p: 16Mp, 4k30, 4 Cameras, RGB+IR camera

Media, Display, Audio
  • End to end 10b support: Power optimized HEVC 10 bit encode and VP9 10 bit dec/8 bit encode, 444 format support for HEVC & VP9, 10 bit Display
  • 3 DDI (+1), eDP 1.4b, DP 1.4, HDMI 2.0b, HW HDR Linear scale & blend, FP16. Outdoor LACE
  • Programmable Quad-Core Audio DSP, Sound Wire Digital Audio Interface, Intel® Gaussian & Neural Accelerator (Intel® GNA) for low-power neural network acceleration

I/O & Connectivity
  • Integrated Wi-Fi*/BT (CNVi AC/Wi-Fi 6 support) - Intel® Wi-Fi 6 AX201 (2x2/160 MHz, Gig)
  • Integrated USB Type-C* (USB 3 (10G), Thunderbolt™ 3 technology, DisplayPort 1.4) – up to 4 ports

Storage
  • Next Gen Intel® Optane™ memory SSDs/Memory, PCIe* 3.0, SATA, SD 3.0, eMMC 5.1

Security
  • SGX 2.0 with Ecosystem scaling (e.g ROP)

Board Area saving
  • Board Savings16 due to IP Integration FIVR (both CPU and PCH), Type-C sub system, HDMI2.0/HDCP2.2, Wi-Fi* (CNVi MAC) etc.
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10th Gen Intel® Core™ U-Series Processor

Premium PCH-LP

 

 

0-317 x SATA 6Gb/s

AHCI, RAID, RST 17 (AHCI and RAID), Intel® Rapid Storage Technology (Intel® RST) for PCIe* Storage, eMMC 5.1, SDXC 3.0

6 PCIe* Gen 3 Devices across 16 Lanes17

Boot Guard, Integrated Wi-Fi 6 (Wi-Fi/BT)

10 x USB 218

6 x USB 3.2 Gen 1x1 (5 Gb/s) or

USB 3.2 Gen 2x1 (10 Gb/s)17

6 I2C, 3 UART, SSIC, ISH 5.2

Intel® Smart Sound Technology (Intel® SST) w/ I2S OR HDA Solution, DMIC, Soundwire Interface

18Enabled with I/O Port Flexibility.

19The total USB 2.0 port availability will also take into account the USB 2.0 port requirement for integrated Bluetooth® technology functionality.
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Y-Series Processor Feature Benefits

Features

Benefits

CPU
  • 10nm Quad Core CPU / 14nm PCH

GFX
  • Gen 11 Intel Graphics Engine
  • GFX: GT2 = up to 64EU2

Memory
  • LPDDR4/x-3733

Imaging
  • IPU4p: 16Mp, 4k30, 4 Cameras, RGB+IR camera

Media, Display, Audio
  • 444 format support for HEVC & VP9, 10 bit Display
  • eDP 1.4b, DP 1.4, HDMI 2.0b, HW HDR Linear scale & blend, FP16. Outdoor LACE
  • Intel® Gaussian & Neural Accelerator (Intel® GNA)

I/O & Connectivity
  • Integrated Wi-Fi*/BT (CNVi AC/Wi-Fi 6 support) - Intel® Wi-Fi 6 AX201 (2x2/160 MHz, Gig+)
  • Integrated USB Type-C* (USB 3.2 Gen 2x1, Thunderbolt™ 3 technology, DisplayPort 1.4) – up to 3 ports

WWAN
  • XMM7360 & XMM7560 M.2

Security
  • SGX 2.0 with Ecosystem scaling (e.g ROP)

Board Area Saving
  • Additional Board Savings16 with PCH FIVR integration and the above integrations.
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10th Gen Intel® Core™ Y-Series Processor

Premium PCH -LP

   
0-217 x SATA 6Gb/s AHCI, RAID, RST 17 (AHCI and RAID), Intel® Rapid Storage Technology (Intel® RST) for PCIe* Storage, eMMC 5.1, SDXC 3.0
5 PCIe* Gen 3 Devices across 14 Lanes17 Intel® Smart Sound Technology (Intel® SST) w/I2S or HDA Solution, DMIC, Soundwire Interface
6 x USB 218 Boot Guard, Integrated Wi-Fi 6 (Wi-Fi/BT), FIVR

6 x USB 3.2 Gen 1x1 (5 Gb/s)17

or USB 3.2 Gen 2x1 (10 Gb/s)17

 6 I2C, 3 UART , USB Dual Mode, SSIC, ISH 5.2

18Enabled with I/O Port Flexibility.

19The total USB 2.0 port availability will also take into account the USB 2.0 port requirement for integrated Bluetooth® technology functionality.
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Intel® Core™ Mobile Processors


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제품 및 성능 정보

1Not available on all SKUs.
2

eSATA, USB 및 IEEE 1394 Firewire* 등의 다른 PC I/O 연결 기술과 비교 시. 성능은 하드웨어 및 소프트웨어 구성에 따라 달라집니다. Thunderbolt™ 지원 기기를 사용해야 합니다.

3NOT ALL FEATURES INDICATED ARE SUPPORTED ON ALL SKUS.
4Level of support may vary by SKU.
5ICL U UHD SKUs available with 12W cTDP down.
6TDP workload does not reflect various I/O connectivity cases such as iTBT. Refer to the Platform Design Guide (Doc #572907), Thermal Power Consideration section for adjustments to the base TDP required to preserve base frequency associated to the sustained long-term thermal capability.
78W cTDP down available on ICL Y Core i3.
8Not available on ICL U Core i3 SKUs.
9Included features are NOT available on all platforms with Intel® Dynamic Tuning Technology.
10Deep S3 is a term used to describe several methods Intel plans to promote to minimize S3 power consumption.
11Switchable Graphics will be referred to as Hybrid Graphics in Windows* 8.1, Windows* 10. Not supported Linux.
12Resolution are supported when VDSC enabled, PSR2 is not supported concurrent with VDSC.
13Using ModPHY / Type –C. ComboPHY will only support DP 1.4 w HBR2.
14For streaming over 4k60 (10bit) content on more than one stream simultaneously, additional thermals need to be considered.
15May need additional thermal requirements.
16

클럭 주파수나 전압을 바꾸면 프로세스 및 기타 시스템 구성 요소의 수명이 손상 또는 단축될 수 있으며, 시스템 안정성과 성능에 부정적인 영향이 미칠 수 있습니다. 프로세서가 사양 외 환경에서 사용된 경우 제품 보증이 적용되지 않을 수 있습니다. 추가 정보는 시스템 및 구성 요소 제조업체에 문의하십시오.

17Enabled with I/O Port Flexibility.
18The total USB 2.0 port availability will also take into account the USB 2.0 port requirement for integrated Bluetooth® technology functionality.